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mechanical.engineering | materials science & engineering | university.of.washington | my.uw

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syllabus

notes

assignments

exams

  · 1    Forced connective heat transfer from modules on board

  · 2    Thermal Interface Material with High Thermal Conductivity

  · 3    Electromagnetic Part

  · 4    Thin film cladding

  · 5    Transients on TL-b,   lecture notes

  · 6    Laptop cooling basics